One step
The self-etching formula shortens the procedure: no separate etchant application needed.
Vericom U-Bond – Self-Etch Adhesive
€67,76
€56,00 excl. VAT
Price incl. VAT · VAT invoice with every order
DPD / UPS courier delivery · usually 2–7 business days
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Vericom U-Bond is a seventh-generation one-step, self-etch, light-cure adhesive for bonding composite to enamel and dentin in direct restorations. No separate etching step is required – etching and adhesive application are combined into a single step.Vericom nanoparticle dispersion technology keeps hydrophilic and...
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Description
Vericom U-Bond is a seventh-generation one-step, self-etch, light-cure adhesive for bonding composite to enamel and dentin in direct restorations. No separate etching step is required – etching and adhesive application are combined into a single step.
Vericom nanoparticle dispersion technology keeps hydrophilic and hydrophobic monomers in a homogeneous mixture even as the solvent evaporates, so no phase separation occurs. The nanoparticles and the bonding monomers 4-META and phosphate methacrylate ensure strong, stable adhesion. The resulting layer is thinner than 10 µm and uniform across the entire surface.
- One step – no separate etching
- Nanoparticle technology – no phase separation
- Film thickness < 10 µm
- Suitable for everyday direct restorations
Nanoparticle technology
Vericom dispersion technology prevents phase separation as the solvent evaporates.
Thin layer
A uniform layer thinner than 10 µm helps precisely control restoration margins.
Strong bonding
4-META and phosphate methacrylate monomers ensure reliable bonding to enamel and dentin.
Technical data
- Generation
- 7th (self-etch, single-step)
- Layer thickness
- < 10 µm
- Curing
- Light
- Volume
- 5 ml
